LOCTITE® Helps Cut 35% Scrap Rate in Electronics

LOCTITE® Helps Cut 35% Scrap Rate in Electronics

Customer Challenge: Reducing Scrap and Post-Shipment Failures

A leading consumer electronics manufacturer was facing significant challenges during the production of its Bluetooth headsets. A staggering 35% of units were being scrapped during assembly due to adhesive bond failures. While many of the issues occurred within the first hour after the components were bonded, others only became apparent after the headsets were shipped to customers.

These delayed bond failures posed a major risk to the brand's reputation. Not only did they result in costly product returns and warranty claims, but they also threatened to erode consumer trust in the product’s quality and durability—particularly in a highly competitive electronics market.

The manufacturer's internal team had attempted various fixes but could not achieve consistent reliability. They needed a long-term adhesive solution that would deliver both immediate bond strength and long-lasting performance, even under stress from handling, transportation, and real-world use.


Henkel Solution: Engineering Adhesive Performance Into the Process

The manufacturer turned to Henkel's LOCTITE® Technical Sales Engineer for support. Henkel’s expert conducted a comprehensive review of the headset design, bonding materials, and assembly process. This technical assessment revealed that a single adhesive solution was not ideal for the two critical joints in the headset's assembly. Each joint had different material interfaces, mechanical stresses, and functional demands.

To address this, Henkel proposed a dual-adhesive strategy:

  • LOCTITE® 4902™: This instant adhesive was used to bond the perimeter of the headset housing, where a fast cure and strong, flexible bond were essential. It offered excellent performance in dynamic environments, including high humidity and thermal cycling conditions.
  • LOCTITE® 454™: A gel-based instant adhesive, LOCTITE® 454™ was selected for bonding the headset tip, which required precise application and gap-filling capability. Its fast fixture time and versatility across multiple substrates made it ideal for securing small components without mess or overflow.

Henkel also supported the manufacturer by training the assembly team on best practices for adhesive application, including proper dispensing techniques, surface preparation, and curing conditions. This ensured consistency across production shifts and further improved product quality.


Results: High Bond Reliability, Reduced Scrap, and Lower Warranty Costs

The introduction of LOCTITE® 4902™ and LOCTITE® 454™ provided a seamless and effective solution for the manufacturer. After extensive validation, the adhesives were shown to exceed performance standards, including:

  • Drop testing
  • Thermal cycling
  • Humidity aging
  • Pull strength

Following implementation:

  • The scrap rate dropped from 35% to nearly zero, representing significant cost savings.
  • Post-shipment bond failures were eliminated, resulting in fewer warranty claims and improved customer satisfaction.
  • The assembly line became more efficient thanks to the faster curing times and simplified application process.
  • The manufacturer regained confidence in their product and strengthened their brand’s reputation for quality and reliability.

Henkel’s customized approach, technical expertise, and high-performance adhesives not only solved a critical production problem but also elevated the overall manufacturing process.

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